Message from the TC 9.9 Officers - March 2008

We had a very exciting and productive meeting in New York City, thanks to everyone who participated and attended the program sessions and various committee meetings!

Typical committee business was conducted during the first part of the general meeting.  The second half of the general meeting and most of Tuesday’s planning session focused on an IT industry proposal to extend the recommended temperature and humidity ranges for Datacom equipment.   Once finalized in a couple months, these ranges will be published.

Roadmap

Two new publications from TC 9.9 are now available for at ASHRAE bookstore.  They are “Best Practices in Datacom Facility Energy Efficiency” and “Structural and Vibration Guidelines for Datacom Equipment Centers”.  These are the 5^th and 6^th books published by TC 9.9.

The ASHRAE TC9.9 committee currently has plans for two other books to be completed this year. The list of books scheduled for publication this year is “High Density Data Center - case studies and other considerations” and “Contamination in Datacom Equipment Centers”.

The committee agreed to start work on several new books including Economizers for Datacenters; CFD for Datacenters; Green Tips for Datacenters; Cooling Technologies for Datacom Rooms; and IT Facility Measurements and Control of Datacenters.  The committee is seeking individuals with expertise in any of these areas to participate on the these publications.  Please send an email to Roger Schmidt, if interested.

Future Programs

Salt Lake City (June 2008)

The following abstracts are for two seminars tentatively planned for Salt Lake City.

TITLE: Data Centers: The new ASHRAE Environmental Equipment Specification for IT Equipment

Abstract: ASHRAE TC9.9 Published a Guideline for IT Environmental Equipment Specification in 2004. That Guideline has been widely accepted and succesfully used to provide a common starting point for Data Center design and operations cooling system performance. In addition, the vast majority of IT equipment manufacturers all support the guideline and have been involved in it's development. As a response to the industry desire to save energy through a wider range, TC9.9 has recently expanded the recommended range for both Temperature and Humidity. This seminar reviews the development of this guideline and the impact to the industry of widening the range.

TITLE: Innovations in Airflow Management within Rack Enclosures

Abstract: With increasing heat loads in the data centers proper management of airflow within rack enclosures has become crucial. While avoiding any mixing of hot air with the incoming cold air, effective management and removal of hot air from the rack enclosures is the key factor in maintaining server inlet air temperatures within ASHRAE recommended guidelines. This seminar will provide an overview of issues and recent design innovations for airflow management within rack enclosures.

Chicago (Jan 2009)

Listed below are 2 Call for Papers for Transactions sessions planned for Chicago 2009.

ASHRAE  Technical Committee 9.9 (Mission Critical Facilities, Technology Spaces and Electronic Equipment), is sponsoring a Transactions session for January 2009 ASHRAE Winter Meeting in Chicago, Illinois, and seeks papers for transaction session High Density Cooling Issues Update – January 2009.  This transactions session will accept papers on a variety of issues that are pertinent to the cooling of high density data centers, telecommunications facilities, and combinations thereof.  Issues of recent concern include planning for future data centers, site selection criteria and guidelines, development and use of value model to aid in site selection.  Papers are due for review on ASHRAE’s Manuscript Central by April 4, 2008.  Transactions chair/contact: Jeffrey Rutt 240-373-5790.

ASHRAE  Technical Committee 9.9 (Mission Critical Facilities, Technology Spaces and Electronic Equipment), is sponsoring a Transactions session for January 2009 ASHRAE Winter Meeting in Chicago, Illinois, and seeks papers for transaction session Liquid Cooling Issues Update – January 2009.  This transactions session will accept papers on a variety of issues that are pertinent to the cooling of high density data centers, telecommunications facilities, and combinations thereof.  Issues of recent concern include lessons learned with recent liquid cooling products, reliability issues or best practices, and the return to liquid cooling and transitional technologies for cooling.  Papers are due for review on ASHRAE’s Manuscript Central by April 4, 2008.  Transactions chair/contact: Jeff Trower 714-921-6010.

MESSAGE FROM >>>

Roger Schmidt (Chair) – IBM & Jeff Rutt (Vice Chair) – Dept. of Defense

This technical committee is concerned with all aspects of Mission Critical Facilities, Technology Spaces, and Electronic Equipment / Systems. This includes data centers, computer rooms / closets, raised floor environments, high density loads, emergency / network operations centers, telecom facilities, communication rooms / closets, and electronic equipment rooms / closets.

If you would like to get involved in this TC's issues at the Society level, read through the pages of this site, attend the biannual meetings, or contact our committee chair, Roger Schmidt, at c28rrs@us.ibm.com.

Committee Chair:

Roger Schmidt, Ph.D., P.E.
IBM
44 Loockerman Ave
Poughkeepsie, NY 12601
c28rrs@us.ibm.com

Upcoming Meetings:

2008 Annual Meeting
Salt Lake City, UT
June 21 - 25, 2008