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ASHRAE Technical Committee 9.9
Mission Critical Facilities, Technology Spaces and Electronic Equipment
NEWS
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Data centers and telecommunications rooms that house datacom equipment are becoming increasingly more difficult to adequately cool. This is a result of IT manufacturers increasing datacom performance year after year at the cost of increased heat dissipation. Even though performance has, in general, increased at a more rapid rate than power, the power required and the resulting heat dissipated by the datacom equipment has increased to a level that is putting a strain on data centers.
In the struggle to improve the thermal management characteristics of data centers, it is sometimes important to assess today’s data center designs. The objective of this book is to provide a series of case studies of high density data centers and a range of ventilation schemes that demonstrate how loads can be cooled using a number of different approaches.
This book is the seventh in a series of datacom books authored by ASHRAE Technical Committee 9.9, Mission Critical Facilities, Technology Spaces and Electronic Equipment. The other books, listed in order of publication, are: Thermal Guidelines for Data Processing Environments (2004), Datacom Equipment Power Trends and Cooling Applications (2005), Design Considerations for Datacom Equipment Centers (2006), Liquid Cooling Guidelines for Datacom Equipment Centers (2006), Structural and Vibration Guidelines for Datacom Equipment Centers (2007), and Best Practices for Datacom Facility Energy Efficiency (2008).
It is 6 x 9 in. in size and softcover. The book was printed on 30% post-consumer waste using soy-based inks.
Format: Softcover
Units: Dual
Publisher: ASHRAE
Year: 2008
Number of Pages: 193
ISBN/ISSN: 6331-2-403-000000-43
Sponsor: TC 9.9
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ASHRAE TC9.9 Salt Lake City (June 2008) Programs – Calls for Papers
ASHRAE Technical Committee 9.9 (Mission Critical Facilities, Technology Spaces and Electronic Equipment), is sponsoring a Transactions session for the June 2008 ASHRAE Winter Meeting in Salt Lake City, Utah, and seeks papers for the transaction session High Density Cooling Issues Update - June 2008. This transactions session will accept papers on a variety of issues that are pertinent to the cooling of high density data centers, telecommunications facilities, and combinations thereof. Issues of recent concern include the provision, distribution and control of adequate airflow, the return to liquid cooling, and transitional technologies for cooling.
- Papers are due for review on ASHRAE’s Manuscript Central by November 2, 2007.
- Transactions chair/ contact: Terry L. Rodgers, 301-680-1807
TC9.9 Mission Critical Facilities, Technology Spaces and Electronic Equipment, seeks papers for the transaction session symposium Data Center Liquid Cooling Update – June, 2008. This symposium will accept papers on a variety of issues that are pertinent to data center and telecommunication room liquid cooling. Liquid cooling subjects can include facility liquid cooling, liquid cooling that spans from facilities to server racks or within the server racks themselves. The thermal performance of such solutions can be addressed, design and packaging of such systems, pros and cons of such systems including total cost of ownership, energy usage, acoustics, etc.
- Papers are due for review on ASHRAE’s Manuscript Central by November 2, 2007.
- Transactions chair/ contact: Jeff Trower, 714-921-6000 x247
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Sustainable design, global warming, depleting fuel reserves, energy use, and operating cost are becoming increasingly more important. These issues are even more important in datacom equipment centers for reasons such as the following:
- Large, concentrated use of energy (can be 100 times the watts per square foot of an office building)
- 7 x 24 operations have about three times the annual operating hours as other commercial properties
The intent of this publication, as part of the ongoing ASHRAE Datacom Series, is to provide the reader with detailed information on the design of datacom facilities that will aid in minimizing the life-cycle cost to the client, and to maximize energy efficiency in a facility to align with ASHRAE's stated direction (from the 2006 Strategic Plan) to "lead the advancement of sustainable building design and operations."
This book covers many aspects of datacom facility energy efficiency, and includes chapters on the topics of environmental criteria, mechanical equipment and systems, economizer cycles, airflow distribution, HVAC controls and energy management, electrical distribution equipment, datacom equipment efficiency, liquid cooling, total cost of ownership, and emerging technologies. There are also appendices on such topics as facility commissioning, operations and maintenance, and the telecom facility experiences.
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This book discusses datacom equipment as well as a building’s structure and infrastructure in a holistic way while providing best practices for their design and installation. This book is divided into four main sections.
Part 1, Introduction, gives an overview of the best practices in the design of datacom equipment centers, including recommendations for new and renovated building structures, building infrastructure, and datacom equipment.
Part 2, Building Structure, covers the design of new and existing structures.
In Part 3, Building Infrastructure, the structural considerations of the building’s infrastructure, raised-access floor systems, and vibration sources and their control are discussed in detail. The last part of this book, Datacom Equipment, covers shock and vibration testing, seismic anchorage systems and analysis of datacom equipment.
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The fourth datacom book authored by ASHRAE TC 9.9, Mission Critical Facilities, Technology Spaces, and Electronic Equipment, is now available. This book is divided into six chapters and includes definitions for liquid and air cooling as it applies to IT equipment, describing the various liquid loops that can exist in a building that houses a data center.
It also provides an overview of chilled-water and condenser water systems and of datacom equipment cooling options. The book also bridges the liquid cooling systems by providing guidelines on the interface requirements between the chilled-water system and the technology cooling system and outlines the requirements of those liquid-cooled systems that attach to a datacom electronics rack and are implemented to aid in data center thermal management.
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This book provides basic information essentials for the design of datacom (data processing and communications) facilities. It covers the topics of design criteria, HVAC loads, cooling systems overview, air distribution and liquid cooling. It will also provides information that is supplemental to basic data center design, which may be of more value to those who already have design and/or operating experience in this field covering additional topics such as ancillary spaces, contamination, acoustics, structural and seismic design, fire suppression, commissioning, availability and redundancy, and energy efficiency.
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The purpose of this book is to discuss datacom (data center and telecommunication) power trends at the equipment level as well as to describe how to use those trends in making critical decisions on infrastructure (e.g., cooling system) requirements and the overall facility.
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This document is the first major product developed by ASHRAE TC 9.9 and is the culmination of 3 years of work by over 30 firms.
It provides equipment manufacturers and facility operations personnel with a common set of guidelines for environmental conditions, including:
- Standardized operating environments for equipment.
- A common environmental interface for the equipment and its surroundings.
- Guidance on how to evaluate and test the operational health of the data center.
- A methodology for reporting the environmental characteristics of a computer system.
- Essentially, the focus of this guideline is on electronic equipment and its interaction with its environment. Since it had an equipment focus, participants in this document included a very strong representation from many leading computer equipment manufacturers.
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